In semiconductor packaging industy, most numerical simulation would only focus on the warpage caused by different temperature conduction in material.
However, in many case study, numerical simulation results are very different from the reality either in numbers of warpage or the warpage direction.
After further research, test statistic shows that cure-induced of epoxy not only affect the specific volume of material itself but also cause the warpage.
Sometimes warpage caused by cure-induced has similar influence to those caused by different temperature conduction; in some cases even the main reason which causes overall warpage
can test degree of cure and set up the formula between degree of cure and specific volume under different temperature and pressure.
For more detailed information please contact us: U-CAN DYNATEX INC.