In semiconductor packaging industry, most numerical simulation of shrinkage would only consider the thermal effect of material.
However, in many case study, the significant difference between simulation and reality is not only the value of deformation but also the trend of warpage.
Analysis shows the cure-induced shrinkage of epoxy is the key. In those cases the effect of cure-induced are at the same level as the thermal effect.
can test the specific volume or volume change under various temperature and pressure to build up the relationship between volume and degree of cured.
For more detailed information please contact us: U-CAN DYNATEX INC.